Kuo doesn’t mention, but it looks like every iPhone 18 will get the new WMCM packaging. Presumably, this boost will make ...

Apple's A20 chip in the iPhone 18 will be packaged with TSMC's Wafer-Level Multi-Chip Module (WMCM) technology, according to ...

Lam Research's early lead in ALD molybdenum tools positions it to gain share in advanced chipmaking for NAND and AI-driven logic.

Apple’s iPhone 18 will feature the new A20 chip with 2nm process and advanced packaging, bringing major gains in speed, ...

Samsung is preparing to invest an additional $7.2 billion in its chip manufacturing operations in the United States, according to reports ahead of the ...

Samsung Electronics is reportedly weighing a major expansion of its semiconductor investments in the US, a move that could ...